pb rohs eh3600etts-33.333m eh36 00 et ts -33.333m series rohs compliant (pb-free) 3.3v 4 pad 3.2mm x 5mm ceramic smd lvcmos high frequency oscillator frequency tolerance/stability 100ppm maximum operating temperature range -40c to +85c nominal frequency 33.333mhz pin 1 connection tri-state (high impedance) duty cycle 50 10(%) electrical specifications nominal frequency 33.333mhz frequency tolerance/stability 100ppm maximum (inclusive of all conditions: calibration tolerance at 25c, frequency stability over the operating temperature range, supply voltage change, output load change, 1st year aging at 25c, shock, and vibration) aging at 25c 5ppm/year maximum operating temperature range -40c to +85c supply voltage 3.3vdc 0.3vdc input current 35ma maximum (no load) output voltage logic high (voh) 2.7vdc minimum (ioh = -8ma) output voltage logic low (vol) 0.5vdc maximum (iol = +8ma) rise/fall time 6nsec maximum (measured at 20% to 80% of waveform) duty cycle 50 10(%) (measured at 50% of waveform) load drive capability 30pf maximum output logic type cmos pin 1 connection tri-state (high impedance) tri-state input voltage (vih and vil) 70% of vdd minimum to enable output, 20% of vdd maximum to disable output, no connect to enable output. absolute clock jitter 250psec maximum, 100psec typical one sigma clock period jitter 50psec maximum, 40psec typical start up time 10msec maximum storage temperature range -55c to +125c environmental & mechanical specifications fine leak test mil-std-883, method 1014, condition a gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-202, method 213, condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev c 8/13/2010 | page 1 of 5
eh3600etts-33.333m mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state 2 ground/case ground 3 output 4 supply voltage line marking 1 e33.333 e=ecliptek designator 1.14 1.0 1.2 (x4) 1.4 (x4) www.ecliptek.com | specification subject to change without notice | rev c 8/13/2010 | page 2 of 5 3.20 0.20 5.00 0.20 1.3 max 2.20 0.15 1.20 0.20 (x4) 1.00 0.20 (x4) 1.20 0.20 (x4) 2.54 0.15 1 2 3 4 marking orient a tion all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
eh3600etts-33.333m www.ecliptek.com | specification subject to change without notice | rev c 8/13/2010 | page 3 of 5 output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 80% of w a v ef or m 50% of w a v ef or m 20% of w a v ef or m f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input supply v oltage (v dd ) t est cir cuit f or cmos output output no connect or t r i-state ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eh3600etts-33.333m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev c 8/13/2010 | page 4 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eh3600etts-33.333m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev c 8/13/2010 | page 5 of 5
|
